Manufacturing method of LED display module
The invention discloses a manufacturing method of an LED display module. The manufacturing method comprises the following steps of: step a) providing a PCB; b) performing mechanical polishing or/and chemical corrosion on a conductive layer, removing the conductive layer and exposing the surface of a...
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creator | LIANG WENJI ZHAO CHUNLEI |
description | The invention discloses a manufacturing method of an LED display module. The manufacturing method comprises the following steps of: step a) providing a PCB; b) performing mechanical polishing or/and chemical corrosion on a conductive layer, removing the conductive layer and exposing the surface of an insulating layer; c) coating photoresist on the surface of the insulating layer, and forming a photoresist layer; d) performing pattern exposure and development on the photoresist layer to form a patterned hollow in the photoresist layer; e) performing directional evaporation on the photoresist layer to form a film, and performing deposition on the surface of the photoresist layer and in graphical hollow to obtain a coating layer; f) stripping the photoresist and reserving the coating layer inthe patterned hollow so as to form bonding pads, and conductively connecting the bonding pad with a conductive column; and g) welding the pins of an LED chip to the bonding pads. The position precision and the size precision |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN112420685A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN112420685A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN112420685A3</originalsourceid><addsrcrecordid>eNrjZNDyTcwrTUtMLiktysxLV8hNLcnIT1HIT1PwcXVRSMksLshJrFTIzU8pzUnlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhkYmRgZmFqaOxsSoAQANgCim</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Manufacturing method of LED display module</title><source>esp@cenet</source><creator>LIANG WENJI ; ZHAO CHUNLEI</creator><creatorcontrib>LIANG WENJI ; ZHAO CHUNLEI</creatorcontrib><description>The invention discloses a manufacturing method of an LED display module. The manufacturing method comprises the following steps of: step a) providing a PCB; b) performing mechanical polishing or/and chemical corrosion on a conductive layer, removing the conductive layer and exposing the surface of an insulating layer; c) coating photoresist on the surface of the insulating layer, and forming a photoresist layer; d) performing pattern exposure and development on the photoresist layer to form a patterned hollow in the photoresist layer; e) performing directional evaporation on the photoresist layer to form a film, and performing deposition on the surface of the photoresist layer and in graphical hollow to obtain a coating layer; f) stripping the photoresist and reserving the coating layer inthe patterned hollow so as to form bonding pads, and conductively connecting the bonding pad with a conductive column; and g) welding the pins of an LED chip to the bonding pads. The position precision and the size precision</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210226&DB=EPODOC&CC=CN&NR=112420685A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210226&DB=EPODOC&CC=CN&NR=112420685A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIANG WENJI</creatorcontrib><creatorcontrib>ZHAO CHUNLEI</creatorcontrib><title>Manufacturing method of LED display module</title><description>The invention discloses a manufacturing method of an LED display module. The manufacturing method comprises the following steps of: step a) providing a PCB; b) performing mechanical polishing or/and chemical corrosion on a conductive layer, removing the conductive layer and exposing the surface of an insulating layer; c) coating photoresist on the surface of the insulating layer, and forming a photoresist layer; d) performing pattern exposure and development on the photoresist layer to form a patterned hollow in the photoresist layer; e) performing directional evaporation on the photoresist layer to form a film, and performing deposition on the surface of the photoresist layer and in graphical hollow to obtain a coating layer; f) stripping the photoresist and reserving the coating layer inthe patterned hollow so as to form bonding pads, and conductively connecting the bonding pad with a conductive column; and g) welding the pins of an LED chip to the bonding pads. The position precision and the size precision</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDyTcwrTUtMLiktysxLV8hNLcnIT1HIT1PwcXVRSMksLshJrFTIzU8pzUnlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhkYmRgZmFqaOxsSoAQANgCim</recordid><startdate>20210226</startdate><enddate>20210226</enddate><creator>LIANG WENJI</creator><creator>ZHAO CHUNLEI</creator><scope>EVB</scope></search><sort><creationdate>20210226</creationdate><title>Manufacturing method of LED display module</title><author>LIANG WENJI ; ZHAO CHUNLEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112420685A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIANG WENJI</creatorcontrib><creatorcontrib>ZHAO CHUNLEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIANG WENJI</au><au>ZHAO CHUNLEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Manufacturing method of LED display module</title><date>2021-02-26</date><risdate>2021</risdate><abstract>The invention discloses a manufacturing method of an LED display module. The manufacturing method comprises the following steps of: step a) providing a PCB; b) performing mechanical polishing or/and chemical corrosion on a conductive layer, removing the conductive layer and exposing the surface of an insulating layer; c) coating photoresist on the surface of the insulating layer, and forming a photoresist layer; d) performing pattern exposure and development on the photoresist layer to form a patterned hollow in the photoresist layer; e) performing directional evaporation on the photoresist layer to form a film, and performing deposition on the surface of the photoresist layer and in graphical hollow to obtain a coating layer; f) stripping the photoresist and reserving the coating layer inthe patterned hollow so as to form bonding pads, and conductively connecting the bonding pad with a conductive column; and g) welding the pins of an LED chip to the bonding pads. The position precision and the size precision</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Manufacturing method of LED display module |
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