Manufacturing method of LED display module
The invention discloses a manufacturing method of an LED display module. The manufacturing method comprises the following steps of: step a) providing a PCB; b) performing mechanical polishing or/and chemical corrosion on a conductive layer, removing the conductive layer and exposing the surface of a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a manufacturing method of an LED display module. The manufacturing method comprises the following steps of: step a) providing a PCB; b) performing mechanical polishing or/and chemical corrosion on a conductive layer, removing the conductive layer and exposing the surface of an insulating layer; c) coating photoresist on the surface of the insulating layer, and forming a photoresist layer; d) performing pattern exposure and development on the photoresist layer to form a patterned hollow in the photoresist layer; e) performing directional evaporation on the photoresist layer to form a film, and performing deposition on the surface of the photoresist layer and in graphical hollow to obtain a coating layer; f) stripping the photoresist and reserving the coating layer inthe patterned hollow so as to form bonding pads, and conductively connecting the bonding pad with a conductive column; and g) welding the pins of an LED chip to the bonding pads. The position precision and the size precision |
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