Hollow part electroplating device

The invention discloses a hollow part electroplating device which belongs to the technical field of electroplating. The device comprises an electroplating slot, an anode assembly and a cathode assembly, wherein a plurality of anode rods which are arranged side by side are arranged above the electrop...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LI HONG, LIU SHENGKAI, LUO DINGLI, QIU LUNHOU, TU XIFENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a hollow part electroplating device which belongs to the technical field of electroplating. The device comprises an electroplating slot, an anode assembly and a cathode assembly, wherein a plurality of anode rods which are arranged side by side are arranged above the electroplating slot; a cathode anode is arranged between adjacent two anode rods above the electroplating slot; the cathode assembly is used for placing a hollow part; the anode assembly is detachably connected to the cathode assembly and is positioned at the inner side of the cathode assembly; the anode assembly and the cathode assembly are kept insulated; the cathode assembly is electrically connected to the cathode rods; and the anode assembly is electrically connected to the anode rods. In an electroplating process, the anode rods are mounted inside the hollow part, and anode plates are mounted outside the hollow part, so that inner and outer surfaces of the hollow part are good in electroplating effect and are high in