Copper surface degreasing agent and composition, preparation method and application thereof

The invention relates to the technical field of degreasing agents, provides an improved copper surface degreasing agent, a composition capable of being used for preparing the copper surface degreasingagent, a preparation method and application of the copper surface degreasing agent in copper surface cleaning of circuit components, and particularly provides a copper surface degreasing agent particularly suitable for a ball grid array packaging process. The copper surface degreasing agent comprise a non-ionic surfactant, a non-ionic wetting agent, a macromolecular viscosity regulator, a pH regulator, an ether compound and a complexing agent. The copper surface degreasing agent has the characteristics of being good in oil removal and rust removal effects; and due to the fact that the surfactant and aids which are low in residue and have little influence on the subsequent nickel-gold electroplating process are selected, the subsequent nickel-gold electroplating process is not influenced under the condition that a