Epoxy adhesive and preparation method and application thereof

The invention relates to a preparation method and application of an epoxy adhesive. The epoxy adhesive is prepared from the following raw materials in parts by weight: 60-100 parts of epoxy resin, 25-45 parts of a toughening agent, 0.5-1.5 parts of a defoaming agent, 20-45 parts of a curing agent, 1...

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Bibliographische Detailangaben
Hauptverfasser: QIAN XUEXING, CHEN FENGYIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a preparation method and application of an epoxy adhesive. The epoxy adhesive is prepared from the following raw materials in parts by weight: 60-100 parts of epoxy resin, 25-45 parts of a toughening agent, 0.5-1.5 parts of a defoaming agent, 20-45 parts of a curing agent, 1.5-5.0 parts of a thixotropic agent, 0.3-1.5 parts of an antioxidant and 0.3-1.5 parts of an ultraviolet absorbent. The preparation method comprises the following steps: (1) mixing and stirring the raw materials according to a formula process to prepare an epoxy glue solution; (2) coating the glue solution on a coating machine according to the conditions that the thickness of a coating film is 200-300 microns, the linear speed is 5m/min, the temperature interval of a drying oven is 100 DEG C/110DEG C/120 DEG C/110 DEG C/100 DEG C, the length of a drying oven section is 12.5 m and the like; and (3) cutting the coated adhesive film, sealing and storing at -5 DEG C. The prepared adhesive filmcan be applied to mini LED