DBC substrate and chip welding method

The invention discloses a DBC substrate and chip welding method. The DBC substrate and chip welding method comprises the steps: S1, cutting a positioning groove in a chip mounting position on a DBC substrate through laser cutting equipment; S2, printing solder paste in the positioning groove or inst...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU LEI, YANG XINGYUN, TAO SHAOYONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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