DBC substrate and chip welding method

The invention discloses a DBC substrate and chip welding method. The DBC substrate and chip welding method comprises the steps: S1, cutting a positioning groove in a chip mounting position on a DBC substrate through laser cutting equipment; S2, printing solder paste in the positioning groove or installing a tin sheet in the positioning groove; S3, placing the chip in the positioning groove, and welding the DBC substrate and the chip. According to the DBC substrate and chip welding method, through the arrangement of the positioning groove, solder paste or a tin sheet becomes liquid at high temperature, the positioning groove limits flowing of the liquid solder paste, the position of the chip cannot deviate, the packaging yield can be improved, the cost can be reduced through the mode, and the risk that a solder mask falls off in the backflow process is avoided. 本发明公开了一种DBC基板与芯片焊接方法，包括步骤：S1、激光切割设备在DBC基板上的芯片安装位切割出定位槽；S2、在定位槽中印刷锡膏或安装锡片；S3、将芯片放置在定位槽中，对DBC基板与芯片进行焊接。本发明的DBC基板与芯片焊接方法，通过设置定位槽，锡膏或锡片在高温下变成液态，定位槽限定了液态锡膏的