METHOD FOR DETERMINING STACK CONFIGURATION OF SUBSTRATE

Described herein is are method for determining a stack configuration for a substrate subjected a patterning process. The method includes obtaining (i) measurement data of a stack configuration with location information on a printed substrate, (ii) a substrate model configured to predict a stack characteristic based on a location of the substrate, and (iii) a stack map including a plurality of stack configurations based on the substrate model. The method iteratively determines values of model parameters of the substrate model based on a fitting between the measurement data and the plurality ofstack configurations of the stack map; and predicts an optimum stack configuration at a particular location based on the substrate model using the values of the model parameters. 描述了一种用于确定针对经受图案化过程的衬底的叠层配置的方法，所述方法包括获得(i)具有在印制的衬底上的部位信息的叠层配置的测量数据，(ii)配置成基于所述衬底的部位来预测叠层特性的衬底模型，以及(iii)包括基于所述衬底模型的多个叠层配置的叠层图。所述方法基于所述测量数据与所述叠层图的多个叠层配置之间的拟合来迭代地确定所述衬底模型的模型参数的值；以及基于所述衬底模型使用所述模型参数的值来预测特定部位处的最优叠层配置。