METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES

Methods and devices related to RF devices are discussed. For manufacturing a device, an RF device is formed at a first side of a semiconductor substrate, and the second side is thinned and then processed. 本公开的实施例涉及与射频设备相关的方法和设备。讨论了与RF设备相关的方法和设备。为了制造设备，在半导体衬底的第一侧处形成RF设备，并且减薄并随后处理第二侧。...

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Hauptverfasser:	HEISS DOMINIK, CATTANEO ANDREA, KADOW CHRISTOPH, TADDIKEN HANS, SOLOMKO VALENTYN, BUTSCHKOW CHRISTIAN, FEICK HENNING, STELTENPOHL ANTON, SEIDEL UWE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Methods and devices related to RF devices are discussed. For manufacturing a device, an RF device is formed at a first side of a semiconductor substrate, and the second side is thinned and then processed. 本公开的实施例涉及与射频设备相关的方法和设备。讨论了与RF设备相关的方法和设备。为了制造设备，在半导体衬底的第一侧处形成RF设备，并且减薄并随后处理第二侧。