Three-dimensional integrated micro-system electro-thermal coupling analysis method based on dual unit method

The invention provides a three-dimensional integrated microsystem electro-thermal coupling analysis method based on a dual unit method. The method includes: carrying out unit mesh generation on the obtained three-dimensional integrated microsystem model; calculating a node load array, an overall topology matrix, an overall temperature change matrix and an overall dual-surface matrix step by step by utilizing initial unit grid information, establishing a heat transfer equation, and adding a charge coupling item into the heat transfer equation based on the influence of temperature on the three-dimensional integrated micro-system model, and finally solving the heat transfer equation to obtain the temperature field of the three-dimensional integrated system model. Compared with the traditionalfinite element, the electro-thermal coupling analysis speed of the three-dimensional integrated micro-system can be effectively improved on the premise of ensuring the precision. 本发明提供的一种基于对偶单元法的三维集成微系统电热耦合分析方法，通过对已经获取的三维集成微