ADHESIVE COMPOSITION CONTAINING ACRYLONITRILE BUTADIENE RUBBER COPOLYMERIZED POLYAMIDE IMIDE RESIN

The present invention provides an adhesive composition which has improved solder heat resistance after moisture absorption, excellent flowability and excellent B-stage adhesive film provisional bondability, while exhibiting adhesiveness, insulation reliability, flame retardancy and B-stage adhesive film embrittlement resistance. An adhesive composition which contains (A1) a polyamide imide resin that does not contain an acrylonitrile butadiene rubber, (A2) an acrylonitrile butadiene rubber copolymerized polyamide imide resin, and (B) an epoxy resin that has two or more epoxy groups in each molecule, and which forms a homogeneous phase. With respect to this adhesive composition, (i) the A1/A2 mass ratio in the composition is from 0.1 to 1.0 (inclusive), (ii) the (A1 + A2)/B mass ratio in the composition is from 0.9 to 3.6 (inclusive), and (iii) the component (A2) is a resin which comprises, as copolymerization components, (a) a polycarboxylic acid derivative having an acid anhydride group, (b) an isocyanate co