SEMICONDUCTOR DEVICE

Disclosed is a semiconductor device including a semiconductor die, a base member, a side wall, first and second conductive films, and first and second conductive leads. The base member has a conductive main surface including a region that mounts the semiconductor die. The side wall surrounds the region and is made of a dielectric. The side wall includes first and second portions. The first and second conductive films are provided on the first and second portions, respectively and are electrically connected to the semiconductor die. The first and second conductive leads are conductively bondedto the first and second conductive films, respectively. At least one of the first and second portions includes a recess on its back surface facing the base member, and the recess defines a gap betweenthe at least one of the first and second portions below the corresponding conductive film and the base member. 本发明公开了一种半导体器件，包括半导体管芯、基部构件、侧壁、第一导电膜和第二导电膜以及第一导电引线和第二导电引线。基部构件具有导电主表面，该导电主表面包括安装半导体管芯的区域。侧壁包围该区域并且由介电体制成。侧壁包括第一部分和第