High-layer-thickness sintering method and equipment for selective laser sintering
The invention provides a high-layer-thickness sintering method for selective laser sintering. The method comprises the following steps: uniformly blending polymer powder and metal powder in a mass part ratio of (30-70): (30-70) to obtain a polymer composite powder material; and putting the polymer c...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a high-layer-thickness sintering method for selective laser sintering. The method comprises the following steps: uniformly blending polymer powder and metal powder in a mass part ratio of (30-70): (30-70) to obtain a polymer composite powder material; and putting the polymer composite powder material into selective laser sintering equipment with a CO2 laser and an optical fiber laser as a mixed light source to be sintered. The sintering process specifically comprises the steps of laying the polymer composite powder material with the layer thickness of 0.3-2.0 mm, and preheating the polymer composite powder material to the set temperature, wherein the set temperature is 5-20 DEG C lower than the melting point of the polymer powder; and sintering the powder of a to-be-sintered layer by adopting the optical fiber laser, sintering the powder of the to-be-sintered layer by adopting the CO2 laser, and repeating the sintering process until workpiece sintering is completed. According to the sin |
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