SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CLEANING METHOD

The invention relates to a substrate cleaning apparatus, a substrate processing apparatus, and a substrate cleaning method. The substrate cleaning apparatus includes a substrate holding mechanism holding a substrate, a rotation mechanism rotating the substrate held by the substrate holding mechanism...

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1. Verfasser: NAKANO HISAJIRO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a substrate cleaning apparatus, a substrate processing apparatus, and a substrate cleaning method. The substrate cleaning apparatus includes a substrate holding mechanism holding a substrate, a rotation mechanism rotating the substrate held by the substrate holding mechanism, and a cleaning mechanism cleaning the substrate. The cleaning mechanism includes a support column,an arm extending from the support column and having a fixed height position, a cleaning tool supported by the arm and cleaning a surface of the substrate by contacting the surface, a lift mechanism moving the cleaning tool vertically with respect to the arm between an raised position separated from the substrate and a lowered position in contact with the substrate, and a controller controlling atleast a speed at which the cleaning tool descends. 本发明涉及基板清洗装置、基板处理装置及基板清洗方法。基板清洗装置具备:保持基板的基板保持机构;使保持于基板保持机构的基板旋转的旋转机构;及清洗基板的清洗机构。清洗机构具备:支柱;从支柱伸出且其高度位置不变动的支臂;支撑于支臂且通过抵接于基板表面来清洗表面的清洗件;使清洗件在从基板离开的上升位置与抵接于基板的下降位置之间相对于支臂升降的升降机构;及