CONDUCTIVE PASTE AND SINTERED BODY
The purpose of the present invention is to provide a conductive paste which, when formed as a sintered body, exhibits a low electrical resistance value and excellent conductivity, and a sintered bodyof the conductive paste. The conductive paste is characterized in that: flake-like silver powder havi...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The purpose of the present invention is to provide a conductive paste which, when formed as a sintered body, exhibits a low electrical resistance value and excellent conductivity, and a sintered bodyof the conductive paste. The conductive paste is characterized in that: flake-like silver powder having a median diameter D50 of 15 um or less, silver powder having a median diameter D50 of 25 um or more, and a solvent are contained; and, with respect to 100 parts by mass of the total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 um or more, the content of the flake-like silver powder is 15-70 parts by mass and the content of the silver powder having a median diameter D50 of 25 um or more is 30-85 parts by mass.
本发明的目的在于,提供制成烧结体时的电阻值低、导电性优异的导电性糊料和其烧结体。导电性糊料,其包含具有15μm以下的中位直径D50的薄片状银粉、具有25μm以上的中位直径D50的银粉和溶剂,相对于前述薄片状银粉与前述具有25μm以上的中位直径D50的银粉的总计100质量份,前述薄片状银粉的含量为15~70质量份,前述具有25μm以上的中位直径D50的银粉的含量为30~85质量份。 |
---|