CRYOGENIC COMPUTING SYSTEM WITH THERMAL MANAGEMENT USING A METAL PREFORM

Computing systems including heat sinks (e.g., a first and a second heatsink) and metal preforms (e.g., a first and a second metal preform) are provided. The first metal preform is bonded to a portionof the first heat sink, where the first metal preform is configured to conform to the at least a portion of a superconducting component when the superconducting component is pressed against the firstmetal preform and hold shape even after a first pressure on the first metal preform is relieved. The computing system includes a second metal preform bonded to a portion of the second heat sink, wherethe second metal preform is configured to conform to the at least the portion of a superconducting component when the superconducting component is pressed against the second metal preform and hold shape even after a second pressure on the second metal preform is relieved. 提供了包括散热器(例如，第一散热器和第二散热器)和金属预成型件(例如，第一金属预成型件和第二金属预成型件)的计算系统。第一金属预成型件结合到第一散热器的一部分，其中第一金属预成型件被配置为当超导组件被按压成抵靠在第一金属预成型件上时符合超导组件的至少一部分并且即使在第一金属预成型件上的第一压力被释放之后仍