PHOTOCURABLE RESIN COMPOSITION FOR THREE-DIMENSIONAL MOLDING, THREE-DIMENSIONAL MOLDING METHOD USING SAME, AND THREE-DIMENSIONAL MOLDED PRODUCT

To provide a photocurable resin composition which is for three-dimensional molding and with which a photocurable resin can be cured by light irradiation and molded by stacking in a short period of time while being extruded from a nozzle through a simple FDM method without needing a support material....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ISHIMARU YUYA, KIYOSADA SHUNJI, KUNIHIRO YOSHIO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	To provide a photocurable resin composition which is for three-dimensional molding and with which a photocurable resin can be cured by light irradiation and molded by stacking in a short period of time while being extruded from a nozzle through a simple FDM method without needing a support material. A photocurable resin composition was found which has a viscosity of 0.2 PaS or more at 20 degC anda viscosity of 1,000 PaS or less at 150 degC. [技术问题]本发明要解决的技术问题在于提供一种三维造形用光固化性树脂组合物，其不需要支撑材料，并一边通过简便的FDM方式将光固化性树脂从喷嘴挤出，一边通过光照射使之固化，能够在短时间内进行层叠而造形。[解决手段]本发明发现了一种光固化性树脂组合物，20℃下的黏度为0.2Pa·s以上，且于150℃下的黏度为1000Pa·s以下。