DBC substrate dividing method

The invention discloses a DBC substrate dividing method. The method comprises the steps that S1, a raw material plate is selected; S2, a pre-cutting line is positioned on the raw material plate; and S3, laser cutting equipment cuts the raw material plate along the pre-cutting line, and the raw material plate is divided into a plurality of DBC substrates. According to the DBC substrate dividing method, the laser cutting speed is high, the plate dividing efficiency is high, positioning is accurate, the process consistency of plate dividing each time can be ensured, the failure risk of ceramic damage is avoided, and the yield of products is guaranteed. 本发明公开了一种DBC基板分板方法，包括步骤：S1、选取原料板；S2、在原料板定位预切割线；S3、激光切割设备沿预切割线对原料板进行切割，将原料板分割成多块DBC基板。本发明的DBC基板分板方法，激光切割速度快，分板效率高，定位精准，可以确保每一次分板的工艺一致性，而且没有陶瓷破损的失效风险，产品的良率有保证。