Microwave-millimeter wave packaging device and manufacturing method thereof

The invention provides a microwave-millimeter wave packaging device, and belongs to the technical field of chip packaging. The microwave-millimeter wave packaging device comprises a metal tube shell,a substrate and a plurality of shielding covers, wherein an input connector and an output connector are arranged on the side wall of the metal tube shell, the substrate is arranged in the metal tube shell, a circuit network is arranged in the substrate, and is electrically connected with the input connector and the output connector respectively, a plurality of chip components electrically connected with the circuit network respectively and a plurality of high-frequency chips electrically connected with the circuit network respectively are pasted on the substrate, and the plurality of shieldingcovers are respectively covered on the high-frequency chips and are welded and fixed with the substrate. According to the microwave-millimeter wave packaging device provided by the invention, the mode that the shielding cover