SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

The invention discloses a semiconductor devices and methods of manufacturing the semiconductor devices. In one example, a semiconductor device structure relates to an electronic device, which includesa device top surface, a device bottom surface opposite to the device top surface, device side surfaces extending between the device top surface and the device bottom surface, and pads disposed over the device top surface. Interconnects are connected to the pads, and the interconnects first regions that each extend from a respective pad in in an upward direction, and second regions each connectedto a respective first region, wherein each second region extends from the respective first region in a lateral direction. The interconnects comprise a redistribution pattern on the pads. Other examples and related methods are also disclosed herein. 半导体装置和制造半导体装置的方法。在一个实例中，一种半导体装置结构涉及电子装置，所述电子装置包含装置顶部表面、与所述装置顶部表面相对的装置底部表面、在所述装置顶部表面与所述装置底部表面之间延伸的装置侧表面，以及安置于所述装置顶部表面上的衬垫。互连件连接到所述衬垫，且所述互连件包括：各自在向上方向上从相应衬垫延伸的第一区，以及各自连接到相应第一区的第二区