Chip glue spreading constant-temperature turnover device and method

The invention relates to a chip glue spreading constant-temperature turnover device which comprises an upper die and a lower die which are hemispherical. A complete sphere is formed when the upper dieand the lower die are connected in a clamped manner; the chip gluing constant-temperature turnover device further comprises a feeding assembly, a mechanical arm and a conveying belt; the feeding assembly comprises two guide rail strips which are transversely arranged side by side and a pushing mechanism, and positioning grooves are formed in the two sides of the outer surface of the lower die correspondingly; the conveying belt is obliquely arranged at an angle smaller than 30 degrees, the moving direction of the upper surface of the conveying belt is from low to high, and an electric material baffle is arranged at the lower end of the conveying belt; a glue pouring chamber and a constant-temperature heating unit are arranged on the lower die, and the constant-temperature heating unit comprises a spiral heating w