Pressing-fit device with buffer structure and used for electronic part assembling

The invention discloses a pressing-fit device with a buffer structure and used for electronic part assembling, and relates to the technical field of electronic part assembling. The pressing-fit devicewith the buffer structure and used for electronic part assembling comprises a cover plate and a supporting device, wherein a connecting body is arranged in the bottom of the cover plate; an auxiliarydevice is installed outside the cover plate, and a connecting seat is connected to one end outside the auxiliary device; a main body is arranged at one end outside the connecting seat, and pressing-fit air cylinders are installed at the two ends in the main body separately; and pressing heads are installed at the bottoms of the pressing-fit air cylinders. According to the invention, through the arrangement for the supporting device, when articles are conveyed by virtue of a second conveying belt in a conveying device, the vertical height of a placing assembly can be adjusted by virtue of theinteraction of a first hydr