HEAT DISSIPATION STRUCTURE OF HEAT GENERATING COMPONENT

The present invention provides a heat dissipation structure in which the heat dissipation effect of a heat-generating component mounted on a wiring board of an electronic device is superior to that ofconventional heat dissipation structures. The heat dissipation structure of a heat generating component includes a heat conductive plate that includes a heat receiving connecting part thermally connected to the heat generating component and a heat dissipation connecting part thermally connected to the chassis and an air cooling fan that generates cooling air for cooling the heat conductive plate.The heat conductive plate further includes a first heat dissipation area from which heat is dissipated by flowing the cooling air along a surface of the plate and a second heat dissipation area thatis bent and extends from the first heat dissipation area so as to cross an advancing direction of the cooling air that flows along the surface of the plate at the first heat dissipation area, and fromwhich heat is dissipated by