Defoaming electroplating equipment

The invention relates to the technical field of semiconductor manufacturing, in particular to defoaming electroplating equipment. The defoaming electroplating equipment comprises an electroplating chamber, a metal anode, an electric field line balance film and an ultrasonic oscillation device, wherein a metal cathode surrounds a chamber opening of the electroplating chamber, and a to-be-plated wafer can cover the chamber opening of the electroplating chamber; ions in electroplating liquid have a specific diffusion direction at a selective diffusion film; the selective diffusion film is arranged in the electroplating chamber according to the diffusion direction, the electroplating chamber located in front of the diffusion direction is a diffusion front chamber, and the electroplating chamber located behind the diffusion direction is a diffusion rear chamber; the metal anode is arranged in the diffusion front chamber, and an electric field line can be formed between the metal anode and the metal cathode; the el