POWER SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE

A power semiconductor module (1) is provided with: an insulating substrate (11); a first conductive circuit pattern (13); a second conductive circuit pattern (14); a first semiconductor element (20);a second semiconductor element (21); a sealing member (40); and a first barrier layer (50). The seali...

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Bibliographische Detailangaben
Hauptverfasser:	KAJI YUSUKE, HIRAMATSU SEIKI, TAKI HISAYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A power semiconductor module (1) is provided with: an insulating substrate (11); a first conductive circuit pattern (13); a second conductive circuit pattern (14); a first semiconductor element (20);a second semiconductor element (21); a sealing member (40); and a first barrier layer (50). The sealing member (40) seals the first semiconductor element (20), the second semiconductor element (21), the first conductive circuit pattern (13), and the second conductive circuit pattern (14). At least one of the first barrier layer (50) and the sealing member (40) includes a first stress relaxation part (53). Thus, the power semiconductor module (1) has improved reliability. 功率半导体模块(1)具备绝缘基板(11)、第1导电电路图案(13)、第2导电电路图案(14)、第1半导体元件(20)、第2半导体元件(21)、密封部件(40)以及第1势垒层(50)。密封部件(40)密封第1半导体元件(20)、第2半导体元件(21)、第1导电电路图案(13)以及第2导电电路图案(14)。第1势垒层(50)以及密封部件(40)中的至少1个包括第1应力缓和部(53)。因此，功率半导体模块(1)具有提高的可靠性。