ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND

Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAKUSU TETSUO, KOYANAGI HIDEYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having an imide bond; and a phosphorous compound having a specific structure. 本发明提供一种粘接性、耐热性、操作性、绝缘可靠性优异，适用于粘接膜、覆盖膜、覆铜层叠板等优异的粘接剂组合物。一种粘接剂组合物，其特征在于，含有具有酰亚胺键的树脂及特定结构的磷化合物。