HIGHLY FILLED PLASTISOLS

The present application discloses low-cost plastisols with high filler loading and gel points below 77 DEG C. 本申请公开了低成本的增塑溶胶，其具有高填充剂量，且凝胶点小于77℃。

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Bibliographische Detailangaben
1. Verfasser:	SCHILLING CURTIS LOUIS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present application discloses low-cost plastisols with high filler loading and gel points below 77 DEG C. 本申请公开了低成本的增塑溶胶，其具有高填充剂量，且凝胶点小于77℃。