Nitriding furnace

The invention relates to the technical field of metal treatment, and discloses a nitriding furnace. The nitriding furnace comprises a furnace shell, a flow guide cylinder, a first flow stabilizing plate, a second flow stabilizing plate and an air guide assembly, wherein a medium inlet is formed in o...

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Bibliographische Detailangaben
Hauptverfasser:	YI LIANG, ZHANG YUSUO, ZHAO JIANSEN, MI YANJUN, GUO FEI, ZHANG WEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention relates to the technical field of metal treatment, and discloses a nitriding furnace. The nitriding furnace comprises a furnace shell, a flow guide cylinder, a first flow stabilizing plate, a second flow stabilizing plate and an air guide assembly, wherein a medium inlet is formed in one end of the furnace shell; a flow guide cavity is defined in the flow guide cylinder, and a communication cavity is defined by the flow guide cylinder and the furnace shell in a surrounding manner; first through holes are formed in the first flow stabilizing plate, the sum of the flow areas of thefirst through holes in the unit area of the first flow stabilizing plate is a first flow area, and the first flow area is gradually reduced from the center of the first flow stabilizing plate to theedge; second through holes are formed in the second flow stabilizing plate, the sum of the flow areas of the second through holes in the unit area of the second flow stabilizing plate is a second flowarea, and the second flow