Printed circuit board laminating method and device

The invention discloses a printed circuit board laminating method and device, and the method comprises the steps: obtaining a first heating parameter which comprises a first preset temperature value and a first preset heat preservation duration; in a first operation state, heating the printed circuit board to a target material temperature value according to the first heating parameter; obtaining atarget pressure value; performing layer arrangement processing on the printed circuit board according to the target pressure value and the target material temperature value to obtain a layer arrangement result; and laminating the printed circuit board according to the layer arrangement result. By means of the printed circuit board laminating method, the pressing time can be shortened, meanwhile,stable pressing quality can be guaranteed, and high productivity is achieved. 本发明公开了一种印制电路板压合方法及装置，其中印制电路板压合方法包括：获取第一加热参数，所述第一加热参数包括第一预设温度值和第一预设保温时长；在第一运行状态下，根据所述第一加热参数对印制电路板加热至目标料温值；获取目标压力值；根据所述目标压力值和所述目标料温值对所述印制电路板进行排层处理，得到排