processing device

A processing device is provided to remove the static electricity when the wafer is separated from the holding member. While gradually increasing the area of the part of the lower surface of the dicingtape (T1) which leaves the holding surface (23) of the chuck table (20), ionized air (A1) is blown to the part, thereby removing the static electricity of the dicing tape (T1). Therefore, it is possible to suppress the electrification of the dicing belt (T1) leaving the holding surface (23) of the chuck table (20), and remove the static electricity of the dicing belt (T1) while moving the work group (W1) out of the holding surface (23). Thus, the dicing tape (T1) leaving the holding surface (23) of the chuck table (20) is not easy to carry static electricity. Therefore, it is possible to suppress the degradation of the quality of the device formed on the wafer (W) of the work group (W1). 提供处理装置，在使晶片从保持构件离开时良好地进行静电的除电。一边使划片带(T1)的下表面中的从卡盘工作台(20)的保持面(23)离开的部分的面积逐渐增大，一边向该部分吹送离子化空气(A1)，由此，将划片带(T1)所带的静电去除。因此，能够抑制从卡盘工作台