ETCHING METHOD AND PLASMA PROCESSING APPARATUS

The invention provides an etching method and a plasma processing apparatus. The etching method is implemented by the plasma processing apparatus having an annular member around a substrate placed on asupport table, and the annular member includes a first annular member and a second annular member di...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUSHIMI AKIHITO, ARIYOSHI FUMIAKI, ASAHARA MASANORI, AIZAWA SHUNSUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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