Method and device for processing printed circuit board PCB

The invention provides a method and a device for processing a printed circuit board PCB. Specifically, the test method comprises the following steps: determining the position of an area to be tested on a PCB; removing a designated layer at the position to expose the surface of an insulating layer to generate the to-be-tested area; adjusting and placing a strain gauge on the to-be-tested area for bonding by utilizing an auxiliary image identifier arranged around the to-be-tested area; and connecting a test device to a strain gauge and testing the to-be-tested area. According to the invention, the problem of high cost caused by scrapping of the PCB after the test in a traditional test method is solved, and the effect of reducing the test cost of the PCB is achieved. 本发明提供了一种印制电路板PCB的处理方法及装置。具体而言，该测试方法包括：确定待测试的区域在PCB上的位置；去除该位置的指定层，以裸露所述绝缘层表面生成所述待测试区域；利用所述待测试区域周围设置的辅助图像标识，调整并将应变片放置在所述待测试区域上进行粘合；将测试设备接入至所述应变片并对所述待测试区域进行测试。通过本发明，解决了传统测试方法在测试后PCB会报废带来的高昂成本的问题，达到了降低PCB测试成本的效果。