CONNECTOR, METHOD FOR MANUFACTURING CONNECTOR, AND CONNECTION METHOD
Provided are a connector capable of ensuring the reliability of conduction by capturing conductive particles in spite of the trend toward narrowing of bump width, a method for manufacturing the connector, and a connection method. The connector 40 has a configuration in which a first component 20 hav...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Provided are a connector capable of ensuring the reliability of conduction by capturing conductive particles in spite of the trend toward narrowing of bump width, a method for manufacturing the connector, and a connection method. The connector 40 has a configuration in which a first component 20 having first electrode terminals 21 and a second component 30 having second electrode terminals 31 areconnected together via a filler-containing film 10 having a filler placement layer 13 consisting of a binder resin layer 11 containing individually placed independent fillers 12, wherein the maximum effective terminal area S2 between first electrode terminal 21 and second electrode terminal 31 facing each other is 4,000 micrometer or smaller, and the ratio S2/S1 of an effective terminal area S2to a particle area S1 in a terminal projection plane is 3 or greater.
提供即使在凸块尺寸窄小化之时也能够捕获导电颗粒并确保导通可靠性的连接体、连接体的制造方法、以及连接方法。在具有第一电极端子(21)的第一部件(20)和具有第二电极端子(31)的第二部件(30)经由含填料膜(10)连接的连接体(40)中,含填料膜(10)具有各自独立的填料(12)排列于粘合剂树脂层(11)的填料排列层 |
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