IMAGING DEVICE

According to the present invention, a re-wiring region 22 is provided in a region other than a pixel region 21 on the surface (pixel formation surface) FA of an imaging element 20. A mold part 30 is formed around the imaging element 20 other than on the surface FA. Re-wiring layers 41b, 42b, 43b that connect an external terminal and pads 23 provided in the re-wiring region 22 are formed, via the insulating layers 41a, 42a, 43a, on the pixel formation surface sides of the imaging element 20 and the mold part 30. Thus, even if the spacing between the pads is reduced, connection to a substrate becomes possible, the mounting surface of this imaging device 10 is also on the image formation surface side, and reduction in size and height can be achieved. 根据本发明，重新布线区域(22)设置在摄像元件(20)的正面(像素形成表面)FA上的除像素区域(21)以外的区域中。模制部分(30)形成在除正面FA以外的摄像元件(20)的周围。连接外部端子和设置在重新布线区域(22)中的焊盘(23)的重新布线层(41b)、(42b)、和(43b)经由绝缘层(41a)、(42a)和(43a)形成在摄像元件(20)和模制部分(30)的像素形成表面侧。因此，即使减小焊盘之间的间隔，也能连接到基板，摄像装置(10)的安装表面也位于像素形成表面侧，并且可以减小尺寸和高度。