PCB solder paste printed matter inspection method, device and system

The invention discloses a PCB solder paste printed matter inspection method. The PCB solder paste printed matter inspection method comprises the following steps: reading an image datum point of a PCB;reading a preset pixel point value of the current printing area; obtaining a printing image of the c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TENG MINGFENG, LIU ZUXUE, CHEN BIAO, LI JING, CHEN ZHI, TANG HAIFU, SHI YUHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING PHYSICS PRINTED CIRCUITS TESTING
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