PCB solder paste printed matter inspection method, device and system

The invention discloses a PCB solder paste printed matter inspection method. The PCB solder paste printed matter inspection method comprises the following steps: reading an image datum point of a PCB;reading a preset pixel point value of the current printing area; obtaining a printing image of the current printing area according to the image reference point; calculating the number of pixel pointsof the printed image, and obtaining printed pixel point values; obtaining an absolute value of a difference between the printing pixel point value and a preset pixel point value to form a pixel pointratio; and if the pixel point ratio is greater than the pixel point threshold, outputting detection early warning information. The PCB solder paste printed matter inspection method provided by the invention can automatically judge whether the coverage area of solder paste printing is qualified or not, is simple and effective, and solves the problems of relatively high probability of misjudgment or missed judgment, relative