Contact pin welding method

The invention discloses a pin welding method. The pin welding method comprises the following steps of S1, pre-tinning, printing solder paste at a pin hole in a non-mounting surface of a pin plate; S2,heating to melt the solder paste printed in the step S1 and distribute the solder paste on the periphery and the inner wall of the pin hole; S3, tinning, printing solder paste at the contact pin holes of the mounting surface of the contact pin plate; and S4, reflow soldering of the through holes. The method is advantaged in that the situation that the pins do not extend out of the plate surface and are extremely difficult to weld is improved, and the defect rate of less tin in the pin holes is reduced. 本发明公开了一种插针焊接方法，包括以下步骤：S1、预上锡：在插针板的非贴装面插针孔处印刷锡膏；S2、加热使步骤S1中印刷的锡膏熔化分布在插针孔的外周及内壁；S3、上锡：在插针板的贴装面插针孔处印刷锡膏；S4、通孔回流焊接。本发明具有有利于改善插针未伸出板面的极端难焊接情况、降低插针孔内少锡缺陷率等优点。