Film sheet thermocompression bonding method and system
The invention relates to the technical field of thermocompression bonding of film sheets, in particular to a film sheet thermocompression bonding method and system, and the film sheet thermocompression bonding method comprises the following steps: S1, stripping bottom release paper of double-layer r...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of thermocompression bonding of film sheets, in particular to a film sheet thermocompression bonding method and system, and the film sheet thermocompression bonding method comprises the following steps: S1, stripping bottom release paper of double-layer release paper; S2, cutting the hot melt adhesive layer of the double-layer release paper in a presetshape to form a gluing area and a separation area; S3, stripping the separation area from the top release paper of the double-layer release paper, leaving the gluing area on the top release paper, andseparating the separation area from the gluing area; S4, conducting thermocompression bonding on the gluing area and the surface of a substrate structure; S5, stripping the release paper on the top layer; and S6, carrying out thermocompression bonding on the high-molecular polymer film and the bonding area on the substrate structure. According to the invention, the hot pressing of the gluing areaand the substrate structur |
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