MANUFACTURING EQUIPMENT FOR SEMICONDUCTOR DEVICE

Manufacturing equipment for a semiconductor device is provided, the manufacturing equipment including a spin chuck configured to fix and rotate a wafer; a nozzle configured to spray a chemical towardthe wafer; a lateral displacement sensor configured to measure a displacement variation to a lateral...

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Bibliographische Detailangaben
Hauptverfasser:	JANG SUNG-HUN, KANG HYEON-JUN, OH KYOUNG-WHAN, KANG KYOUNG-WON, LEE JU-BONG, HEO SEOK, HWANG HYUN-WOONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	Manufacturing equipment for a semiconductor device is provided, the manufacturing equipment including a spin chuck configured to fix and rotate a wafer; a nozzle configured to spray a chemical towardthe wafer; a lateral displacement sensor configured to measure a displacement variation to a lateral surface of the wafer while the spin chuck is being rotated; and a controller configured to controla position of the nozzle by using the displacement variation while the spin chuck is being rotated. 一种用于半导体装置的制造设备，所述制造设备包括：旋转卡盘，其被配置为固定并旋转晶圆；喷嘴，其被配置为朝向晶圆喷洒化学试剂；横向位移传感器，其被配置为在旋转卡盘正被旋转的同时测量到的晶圆的侧表面位移变化；以及控制器，其被配置为在旋转卡盘正被旋转的同时通过使用位移变化来控制喷嘴的位置。