Polyamide-imide film and preparation method thereof
The invention provides a polyamide-imide film and a preparation method thereof. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a polydiamine compound, a dianhydride compound, a dicarbonyl compound, and silica particles. Less than 0.5/mum of aggregates having an a...
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| creator | LIN DONG-JIN OH DAE-SEONG KIM SUN-HWAN JEONG DA-WOO LEE JIN-WOO |
| description | The invention provides a polyamide-imide film and a preparation method thereof. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a polydiamine compound, a dianhydride compound, a dicarbonyl compound, and silica particles. Less than 0.5/mum of aggregates having an average diameter of 150 nm to 200 nm can be observed in a cross-section in which the polyamide-imide film is cut in the thickness direction.
本发明提供了一种聚酰胺-酰亚胺膜及其制备方法，上述聚酰胺-酰亚胺膜包含：通过聚合二胺化合物、二酐化合物及二羰基化合物来形成的聚酰胺-酰亚胺聚合物；以及二氧化硅粒子，在以厚度方向切割上述聚酰胺-酰亚胺膜的剖面观察到的平均直径为150nm至200nm的凝聚体少于0.5个/μm2。 |
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本发明提供了一种聚酰胺-酰亚胺膜及其制备方法，上述聚酰胺-酰亚胺膜包含：通过聚合二胺化合物、二酐化合物及二羰基化合物来形成的聚酰胺-酰亚胺聚合物；以及二氧化硅粒子，在以厚度方向切割上述聚酰胺-酰亚胺膜的剖面观察到的平均直径为150nm至200nm的凝聚体少于0.5个/μm2。</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAOyM-pTMzNTEnVzQSRCmmZObkKiXkpCgVFqQWJRYklmfl5CrmpJRn5KQolGalFqflpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3tnP0NDI0MjMwNLA0ZgYNQADISxt</recordid><startdate>20201225</startdate><enddate>20201225</enddate><creator>LIN DONG-JIN</creator><creator>OH DAE-SEONG</creator><creator>KIM SUN-HWAN</creator><creator>JEONG DA-WOO</creator><creator>LEE JIN-WOO</creator><scope>EVB</scope></search><sort><creationdate>20201225</creationdate><title>Polyamide-imide film and preparation method thereof</title><author>LIN DONG-JIN ; OH DAE-SEONG ; KIM SUN-HWAN ; JEONG DA-WOO ; LEE JIN-WOO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN112126090A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN DONG-JIN</creatorcontrib><creatorcontrib>OH DAE-SEONG</creatorcontrib><creatorcontrib>KIM SUN-HWAN</creatorcontrib><creatorcontrib>JEONG DA-WOO</creatorcontrib><creatorcontrib>LEE JIN-WOO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN DONG-JIN</au><au>OH DAE-SEONG</au><au>KIM SUN-HWAN</au><au>JEONG DA-WOO</au><au>LEE JIN-WOO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polyamide-imide film and preparation method thereof</title><date>2020-12-25</date><risdate>2020</risdate><abstract>The invention provides a polyamide-imide film and a preparation method thereof. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a polydiamine compound, a dianhydride compound, a dicarbonyl compound, and silica particles. Less than 0.5/mum of aggregates having an average diameter of 150 nm to 200 nm can be observed in a cross-section in which the polyamide-imide film is cut in the thickness direction.
本发明提供了一种聚酰胺-酰亚胺膜及其制备方法，上述聚酰胺-酰亚胺膜包含：通过聚合二胺化合物、二酐化合物及二羰基化合物来形成的聚酰胺-酰亚胺聚合物；以及二氧化硅粒子，在以厚度方向切割上述聚酰胺-酰亚胺膜的剖面观察到的平均直径为150nm至200nm的凝聚体少于0.5个/μm2。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | Polyamide-imide film and preparation method thereof |
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