Polyamide-imide film and preparation method thereof

The invention provides a polyamide-imide film and a preparation method thereof. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a polydiamine compound, a dianhydride compound, a dicarbonyl compound, and silica particles. Less than 0.5/mum of aggregates having an a...

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Bibliographische Detailangaben
Hauptverfasser:	LIN DONG-JIN, OH DAE-SEONG, KIM SUN-HWAN, JEONG DA-WOO, LEE JIN-WOO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	The invention provides a polyamide-imide film and a preparation method thereof. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a polydiamine compound, a dianhydride compound, a dicarbonyl compound, and silica particles. Less than 0.5/mum of aggregates having an average diameter of 150 nm to 200 nm can be observed in a cross-section in which the polyamide-imide film is cut in the thickness direction. 本发明提供了一种聚酰胺-酰亚胺膜及其制备方法，上述聚酰胺-酰亚胺膜包含：通过聚合二胺化合物、二酐化合物及二羰基化合物来形成的聚酰胺-酰亚胺聚合物；以及二氧化硅粒子，在以厚度方向切割上述聚酰胺-酰亚胺膜的剖面观察到的平均直径为150nm至200nm的凝聚体少于0.5个/μm2。