INTEGRITY MONITOR PERIPHERAL FOR MICROCONTROLLER AND PROCESSOR INPUT/OUTPUT PINS

A semiconductor die includes a feedback path coupled to an output pin, and an integrity monitor circuit (IMC). The output pin is communicatively coupled to a logic circuit generating a data value. TheIMC is configured to receive the data value. The IMC is further configured to receive a measured data value from the output pin routed through the feedback path, compare the data value and the measured data value, and, based on the comparison, determine whether an error has occurred. 一种半导体管芯包括：反馈路径，该反馈路径耦接到输出引脚；和完整性监测电路(IMC)。该输出引脚通信地耦接到生成数据值的逻辑电路。该IMC被配置为接收该数据值。该IMC被进一步配置为从该输出引脚接收被路由通过该反馈路径的测量的数据值，将该数据值与该测量的数据值进行比较，并且基于该比较来确定是否已发生错误。