STACK PACKAGES INCLUDING A SUPPORTING SUBSTRATE

A stack package includes a supporting substrate that supports first and second semiconductor dies. The supporting substrate is disposed on a package substrate and is supported by first and second connection bumps. Redistributed line (RDL) patterns are disposed on the supporting substrate to electrically connect the first semiconductor die to the first and second connection bumps. The second semiconductor dies are connected to the package substrate by bonding wires. 包括支撑基板的层叠封装件。层叠封装件包括支撑第一半导体管芯和第二半导体管芯的支撑基板。支撑基板设置在封装基板上并且由第一连接凸块和第二连接凸块支撑。再分配线(RDL)图案设置在支撑基板上以将第一半导体管芯电连接至第一连接凸块和第二连接凸块。第二半导体管芯通过接合布线连接至封装基板。