ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE

An electronic device includes a housing including a conductive portion, an antenna module disposed in an inner space of the housing and including printed circuit board (PCB) disposed in the inner space, including a first surface and a second surface facing a direction opposite to the first surface, at least one antenna element disposed on the first surface of the PCB or near the first surface in the PCB, a wireless communication circuit disposed on the second surface and configured to transmit and/or receive a radio signal through the at least one antenna element, a protective member disposedon the second surface of the PCB to surround at least partially the wireless communication circuit, and a conductive shielding layer disposed on the protective layer. 电子装置包括：包括导电部分的壳体、设置在壳体的内部空间中的天线模块、以及连接到壳体的导电部分并且至少部分地面向天线模块的导电屏蔽层的导电构件。该天线模块包括：设置在内部空间中并且包括第一表面和面向与第一表面相反的方向的第二表面的印刷电路板(PCB)、设置在PCB的第一表面上或PCB中的第一表面附近的至少一个天线元件、设置在第二表面上并且被配置为通过至少一个天线元件发送和/或接收无线电信号的无线通信电路、设置在PCB的第二表面上以至少部分地围绕无线通信电路的保护构件、以及设置在保护层上的导电屏蔽层。