Image sensor package

The invention relates to an image sensor package. The image sensor package includes a substrate; an image sensor connected to the substrate; a film member disposed on the substrate and defining aholefor exposing an effective image pickup surface of the image sensor; a bonding wire connecting the ima...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HONG JONG CHEOL, YOO DO JAE, WEE HYE-RAN, LEE SOON-KYO, YANG SI-JUNG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention relates to an image sensor package. The image sensor package includes a substrate; an image sensor connected to the substrate; a film member disposed on the substrate and defining aholefor exposing an effective image pickup surface of the image sensor; a bonding wire connecting the image sensor to the substrate; and an optical filter attached to the film member. The membrane memberincludes at least one aperture therein, and at least a portion of the bonding wire is contained within the membrane member. 本申请涉及一种图像传感器封装,其包括衬底;连接到衬底的图像传感器;设置在衬底上并限定用于暴露图像传感器的有效图像拾取表面的孔的膜构件;将图像传感器连接到衬底的接合线;以及附接至膜构件的滤光器。膜构件包括位于其中的至少一个孔隙,并且接合线的至少一部分包含在膜构件内。