SEMICONDUCTOR PACKAGE

A semiconductor package includes a substrate and an interposer disposed on the substrate. The interposer comprises a first surface facing the substrate and a second surface facing away from the substrate. A first logic semiconductor chip is disposed on the first surface of the interposer and is spaced apart from the substrate in a first direction orthogonal to an upper surface of the substrate. Afirst memory package is disposed on the second surface of the interposer. A second memory package is disposed on the second surface of the interposer and is spaced apart from the first memory packagein a second direction that is parallel to the upper surface of the substrate. A first heat transfer unit is disposed on a surface of the substrate facing the first logic semiconductor chip. The firstheat transfer unit is spaced apart from the first logic semiconductor chip in the first direction. 一种半导体封装件包括基板和设置在所述基板上的内插件。所述内插件包括面向所述基板的第一表面和背对所述基板的第二表面。第一逻辑半导体芯片设置在所述内插件的所述第一表面上，并且在与所述基板的上表面垂直的第一方向上与所述基板间隔开。第一存储器封装件设置在所述内插件