Semiconductor device and probe testing method thereof
The invention discloses a semiconductor device, which comprises an upper shell and a lower shell, wherein connecting pipes are arranged on the opposite faces of the upper shell and the lower shell, athreaded groove is formed in the inner wall of the upper shell, a length adjusting pipe is in threade...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a semiconductor device, which comprises an upper shell and a lower shell, wherein connecting pipes are arranged on the opposite faces of the upper shell and the lower shell, athreaded groove is formed in the inner wall of the upper shell, a length adjusting pipe is in threaded connection with the inner wall of the threaded groove, and an outer threaded groove is formed inthe outer surface of the length adjusting pipe. The invention further provides a probe testing method of the semiconductor device, which comprises the steps of S1, rotating the lower shell, taking down the lower shell from the connecting pipe, and installing a connecting column at the bottom end of a transmission pressing rod in a threaded manner. According to the semiconductor test probe, a leftclamp body, a right clamp body and a reset spring are arranged, the transmission pressing rod is pressed, the left clamp body and the right clamp body are in an open state under the action of the reset spring, the left clamp bo |
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