SUBSTRATE VACUUM TREATMENT APPARATUS AND METHOD THEREFORE

SUBSTRATE VACUUM TREATMENT APPARATUS AND METHOD THEREFORE

A vacuum treatment apparatus for substrate comprising a vacuum treatment arrangement (3). An input load-lock arrangement (1i) leads towards and into the vacuum treatment arrangement (3) and an outputload-lock arrangement (1o) leads from the vacuum treatment arrangement (3). One (1i) of the two load-...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZORZI DANIELE, VAN BUUREN GASTON, EGLI CHRISTIAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A vacuum treatment apparatus for substrate comprising a vacuum treatment arrangement (3). An input load-lock arrangement (1i) leads towards and into the vacuum treatment arrangement (3) and an outputload-lock arrangement (1o) leads from the vacuum treatment arrangement (3). One (1i) of the two load-lock arrangements (1i, 1o) comprises at least two load-locks (10ai, 10bi) in series respectively pumped by pumps (12ai, 12bi). 一种用于基体的真空处理设备，其包括真空处理装置（3）。输入负载锁装置（1i）朝向真空处理装置（3）引导并且引导到真空处理装置（3）中，并且输出负载锁装置（1o）从真空处理装置（3）引导出来。两个负载锁装置（1i，1o）中的一个（1i）包括串联的至少两个负载锁（10ai，10bi），所述至少两个负载锁（10ai，10bi）分别由泵（12ai，12bi）来泵送。