PCB structure and circuit slotting and current increasing process for PCB

A circuit slotting and current increasing process for a PCB comprises the following steps: S1, multi-layer bonding pad design: designing the opening diameter and the outer diameter size of a bonding pad according to the pin diameter and the pin shape of an upper component of the PCB, and using mecha...

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Bibliographische Detailangaben

Hauptverfasser:	LIN SHENGSHENG, XIE JIAQING, CHU CHANGZHENG, SHA CHUAN, LI DONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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