PCB structure and circuit slotting and current increasing process for PCB

A circuit slotting and current increasing process for a PCB comprises the following steps: S1, multi-layer bonding pad design: designing the opening diameter and the outer diameter size of a bonding pad according to the pin diameter and the pin shape of an upper component of the PCB, and using mechanical layers on a top signal layer and a bottom signal layer of the PCB by using a multi-layer bonding pad process form; S2, slotting: performing slotting on the signal layer according to a mechanical layer of a preset line; and S3, welding: welding the components on the PCB in a wave soldering modeto form a circuit, realizing uniform adhesion of soldering tin in the groove formed in the step S2, and completing welding of the connecting device while forming the circuit. According to the processprovided by the invention, on the premise of the same width of the through-flow line, no extra process is added, the through-flow capability of the line is greatly improved, the product consistency is good, and a large amount